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RF and Microwave Microelectronics Packaging II

Language EnglishEnglish
Book Hardback
Book RF and Microwave Microelectronics Packaging II Ken Kuang
Libristo code: 15496751
Publishers Springer International Publishing AG, March 2017
This book presents the latest developments in packaging for high-frequency electronics. It is a comp... Full description
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This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

About the book

Full name RF and Microwave Microelectronics Packaging II
Author Ken Kuang, Rick Sturdivant
Language English
Binding Book - Hardback
Date of issue 2017
Number of pages 172
EAN 9783319516967
ISBN 3319516965
Libristo code 15496751
Publishers Springer International Publishing AG
Weight 4085
Dimensions 155 x 235 x 16

Categories

Technology, Engineering, Agriculture > Electronics & communications engineering > Electronics engineering > Electronics: circuits & components
Technology, Engineering, Agriculture > Electronics & communications engineering > Electronics engineering > Microwave technology
Technology, Engineering, Agriculture > Technology: general issues > Engineering: general
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