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Plated Copper Front Side Metallization on Printed Seed-Layers for Silicon Solar Cells.

Language EnglishEnglish
Book Paperback
Book Plated Copper Front Side Metallization on Printed Seed-Layers for Silicon Solar Cells. Achim Kraft
Libristo code: 02892665
Publishers Fraunhofer Verlag, December 2015
A novel front side metallization architecture for silicon solar cells based on a fine printed silver... Full description
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A novel front side metallization architecture for silicon solar cells based on a fine printed silver seed-layer, plated with nickel, copper and silver, is investigated. The work focuses on the printing of fine seed-layers with low silver consumption, the corrosion of the printed seed-layers by the interaction with electrolyte solutions and the encapsulation material on module level and on the long term stability of the cells due to copper migration.

About the book

Full name Plated Copper Front Side Metallization on Printed Seed-Layers for Silicon Solar Cells.
Author Achim Kraft
Language English
Binding Book - Paperback
Date of issue 2015
Number of pages 290
EAN 9783839609392
ISBN 3839609399
Libristo code 02892665
Publishers Fraunhofer Verlag
Weight 429
Dimensions 148 x 210 x 16
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