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Manufacturing Challenges in Electronic Packaging

Language EnglishEnglish
Book Hardback
Book Manufacturing Challenges in Electronic Packaging Y.C. Lee
Libristo code: 01386673
Publishers Chapman and Hall, December 1997
This book provides a single source reference that addresses both advanced packaging and manufacturin... Full description
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This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.

About the book

Full name Manufacturing Challenges in Electronic Packaging
Author Y.C. Lee, W.T. Chen
Language English
Binding Book - Hardback
Date of issue 1997
Number of pages 261
EAN 9780412620300
ISBN 0412620308
Libristo code 01386673
Publishers Chapman and Hall
Weight 1250
Dimensions 155 x 235 x 20

Categories

Technology, Engineering, Agriculture > Industrial chemistry & manufacturing technologies > Industrial chemistry & chemical engineering
Technology, Engineering, Agriculture > Mechanical engineering & materials > Engineering skills & trades
Technology, Engineering, Agriculture > Electronics & communications engineering > Electronics engineering
Mathematics & Science > Chemistry
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