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Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers:§Phase diagrams and alloy development§Effect of minor alloying additions§Composite approaches including nanoscale reinforcements§Mechanical issues affecting reliability§Reliability under impact loading§Thermomechanical fatigue§Chemical issues affecting reliability§Whisker growth§Electromigration§Thermomigration§Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.