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The push toward lead-free components and in turn lead-free soldering in all computers, cell phones and other electronic devices has taken on a greater urgency in as laws have been passed and are pending in the United States, the European Union and Asia which ban lead and lead-bearing solder. These new restrictions on hazardous substances are changing the way electronic devices are assembled and specifically affect process engineering, manufacturing and quality assurance.This book offers in a single volume a broad collection of practical techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources. The book includes the latest information on proposed changes to lead-free standards, and up-to-date analysis of government and legislative activities and regulations in North America, Europe and Asia.