Advances of Lead-Free Solder

Processing & Characterization provides information on most implemented lead-free solder processing, reaction mechanism and characterization techniques involved. This book also includes a newly invented composite lead-free solder processing and characterization techniques. The resulted presented in this book were part of the experimental works at Universiti Malaysia Perlis (UniMAP) and National University of Malaysia (UKM). The chapters are organized around the following subject areas: solder developments, fundamental issues, mechanical and electrical properties, the factors affecting the reliability of lead-free solders and the processing techniques of new lead-free solder composite. It is not intended to be an exhaustive review of the literature but to be a practical reference guide for selected, key subject areas. The topics are in sufficient detail to be informative and a good practical guide to address issues of concern in lead-free solder areas. It is hope that this book provides wider awareness of the current status of lead-free electronic solders.